Strain Measurement Using Copper Electroplating Method

초록

In the present study, the effect of stress concentration due to inclusions and in slit tips is considered in order to increase the sensitivity of the stress measurement technique of copper electroplating. As an application of this method, it is believed that low-level stress under cyclic stress can be measured

제목
Strain Measurement Using Copper Electroplating Method
저자
권석진; 서정원; 이동형
발행일
2013-09-05
학회명
international conference on advances in experimental mechanics