Design Considerations with Different Shielding Barriers and HTS Resonance Coils for Wireless Power Charging Unit in High-Speed Magnetic Levitation Train

Citations

WEB OF SCIENCE

0
Citations

SCOPUS

3

초록

Authors have been developed the wireless power charging (WPC) unit for high-speed superconducting magnetic levitation (MAGLEV) train to evaluate the transfer efficiency and stability since the WPC system can supply electric power without overhead wire power lines of pantographs. Practically, the various kinds of WPC units have been required in the super high speed transportation systems since it can reduce the construction cost of pantographs. However, in the high-speed MAGLEV train, the antenna (Tx) is installed adjacent to shielding barriers, which is the indispensability structure, can affect the transferred power since the Tx and multiple receiver (Rx) coils are sensitive to impedance variation from external shielding barriers. Also, as the high temperature superconducting (HTS) resonance Rx coils, which is installed in the HTS levitation magnet, will be adopted in the practical system, the charging investigations with HTS resonance coils should be required in the low temperature of 77 K. From these reasons, in this paper, authors presented the thermal distributions, magnetic field distributions for the resonance coils with 370 kHz, 250 W RF power generator under different patterns of shielding barriers. Additionally, the charging performances between copper Tx and HTS resonance Rx coils were evaluated by 370 kHz and 750 kHz of 250 W under the low temperature of 77 K (liquid Nitrogen).

키워드

High temperature superconducting coils; Magnetic levitation train; Shielding barrier effect; Wireless power multi-charging unit
제목
Design Considerations with Different Shielding Barriers and HTS Resonance Coils for Wireless Power Charging Unit in High-Speed Magnetic Levitation Train
저자
Chung, Yoon-Do; Lee, Chang-Young
DOI
10.1007/s42835-023-01674-x
발행일
2024-01
유형
Article; Early Access
저널명
Journal of Electrical Engineering & Technology
권
19
호
1
페이지
277 ~ 284